Message from the Editors & Call For Papers

Aims & Scope

Microsystems or MEMS are well-known synonyms for devices that involve electronic and non-electronic elements and functions and are manufactured on the micro scale.

MEMS may also include sensing functions, signal acquisition and processing, control, actuation, display functions, and even some means for performing chemical and biochemical reactions.

Often ignored, but decisive for economic success are the system aspects. These also comprise such issues as system partitioning, calibration, stability, reliability and high yield (meaning lowcost) production capability.

Lowcost production is also highly related with appropriate assembly and packaging solutions that are in many cases part of the system function as well.

Prominent examples for such microsystems or MEMS are TI's DMDTM chips, ADI's inertia sensors, or Infineon's surface micro machined integrated pressure sensors. We have consciously selected these examples because they are considered to fulfill all of the above-mentioned criteria, and they have been commercially successful in the market as well.

But what about NANOSYSTEMS?

Obviously we cannot reference the same level of prominent and successful industrial examples as we were able to do above for microsystems. Perhaps IBM's Millipede memory or Samsung's field emission display, whose function is defined by electron emitting carbon nanotubes (CNT) sealed in a flat vacuum package that also incorporates the picture generating phosphorus layers at a distance of 200 µm from the CNTs, will come pretty close to that which might be associated with nanosystems of the future.

Obviously we prefer a definition for Nanosystems that emphasizes that they:
  • involve electronic and non-electronic elements and functions at the nano scale for
  • sensing, actuation, signal processing, display, control or interface functions.

In considering Nanosystems, we also want to emphasize such aspects as design, simulation, fabrication, reproducibility, system partitioning, assembly, packaging and qualification, stability and reliability. In other words: The entire engineering task.

But this does not imply that Nanosystems are just miniaturized microsystems. In fact, nanosystems will utilize new functional properties appearing on the nano scale and will overcome limitations as they are known from e.g. disadvantageous scaling properties of MEMS based inertia sensors and lithography based microstructuring. Initial results for self-assembly of nanotubes and exciting sensor properties (conduction vs. mechanical load) have been demonstrated recently, justifying the potential of systems in the nano scale. The new book series on Advanced Micro & Nanosystems (AMN) will focus on these issues.

AMN will cover innovations in technologies, applications and solutions that focus on selected topics in the field. The contributions by internationally acknowledged experts in their field will provide textbook and source book knowledge, thereby providing a quick start for the newcomer and a comprehensive overview for the experienced reader.

Call For Papers

AMN encourages potential authors to write articles on topics in their range of expertise in the style of a review, and comprising 40-80 printed pages in length.

Authors wishing to submit articles to AMN are encouraged to first submit a short outline to one of the editors before completing the full-length article:

Prof. Dr. Oliver Brand
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, GA 30332-0250
USA

Tel +1 404 894 9425
Fax +1 404 894 5028



oliver.brand@ece.gatech.edu
Prof. Dr. Gary K. Fedder
Institute for Complex Engineered Systems
Carnegie Mellon University
Pittsburgh, PA 15213-3890
USA

Tel +1 412 268-8443
Fax +1 412 268-5229


http://www.ece.cmu.edu/~fedder
fedder@ece.cmu.edu
Prof. Dr. Christofer Hierold
Chair of Micro- and Nanosystems
Department of Mechanical and Process Engineering ETH Zürich
Tannenstr. 3
CH-8092 Zürich
Switzerland

Tel +41 (0)44 63 23143
Fax +41 (0)44 63 21462
Mbl +41 (0)79 770 9613

www.micro.mavt.ethz.ch
christofer.hierold@micro.mavt.ethz.ch
Prof. Dr. Jan G. Korvink
Institut for Microstructure Technology
Karlsruhe Institute of Technology
Hermann-von-Helmholtz-Platz 1
D-76344 Eggenstein-Leopoldshafen
Germany


Tel +49 (0)721 608 22740


http://www.imt.kit.edu
jan.korvink@kit.edu
Prof. Dr. Osamu Tabata
Department of Mechanical Engineering
Faculty of Engineering
Kyoto University
Yoshida Honmachi, Sakyo-ku
Kyoto 606-8501
Japan

Tel +81 75 753 4704 (direct)
Fax +81 75 771 7286 (Dept. Office)


http://mech-server.mech.kyoto-u.ac.jp/tabata
tabata@mech.kyoto-u.ac.jp
 

Quick Style Guide
There is no particular style necessary for AMN manuscripts, nor any elaborate layout. If you use standard word processor software, e.g., MS Word, Wordperfect or Open Office, or StarOffice please write your manuscript

  • in a standard font such as Times New Roman
  • at 12pt size
  • with typical margins (1.5 to 2 cm")
  • 1.5 line spacing
  • and capital letter labels to indicate where your figures, schemes and tables should be placed, e.g., "FIGURE 12"
If you plan to use Latex, please retrieve the appropriate style file from http://www.wiley-vch.de/publish/en/authors/auguidelines/.

Most Important Points

Please submit both a printed version and a complete set of electronic files.

In order to be able to typeset the article exactly in the way it was intended, especially mathemati-cal formulae or diagrams, we require a printed original for comparison and reference purposes.

Please submit a separate high resolution (600+ dpi) graphics file for each figure.

This helps us greatly during the copy-editing and technical processing. The file names should be chosen so that the contents can be easily identified, e.g., Smith-figure8.jpg.

Please do not embed figures in word processor or presentation files!

The resolution of pictures embedded in PowerPoint or similar files is usually reduced irreversibly, and the image cannot be extracted in original quality - and a screenful of 1024x768 pixels is no larger than a stamp when printed at the 600 dpi necessary for a book!

Please include an abstract of 80-200 words and approx. 3 to 6 keywords.

Thank you for adhering to these guidelines - which will greatly help eliminate unnecessary correction work for you after the typesetting process!